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Popular News
Daily News
Total : 27 ( 3/3 Pages)
Component Testing
by Micross - 2013-05-20 15:15 - 11,939 views
One fo engineers testing electronic components
Die and Wafer Storage
by Micross - 2013-05-20 15:14 - 11,655 views
This is a video of one of our storage facilities where we store manufacturer's and customer owned parts.
Wafer Sawing
by Micross - 2013-05-20 15:13 - 14,337 views
This is a wafer being sawn in our disco machine.
Wafer View of Auto Pick and Place
by Micross - 2013-05-20 15:13 - 11,850 views
This the view of our equipment selecting die and picking it from a wafer to be placed into packaging.
Screen View of Auto Pick and Place
by Micross - 2013-05-20 15:13 - 11,875 views
This is the screen view of the equipment identifying and lining up each indivisual die to be picked and placed in it's packaging.
Auto Pick and Place Traying Die
by Micross - 2013-05-20 15:13 - 11,588 views
This is a view of our auto pick and place machine selecting die from a silicon wafer and placing it trays dependent on grade.
Automated Dipping and Solder Exchange
by Micross - 2013-05-20 15:12 - 14,986 views
Micross has designed and developed an automated solder dipping process capable of conforming to GEIA 006. The process includes:- Computer control of a six axis dipping robot. Solder dipping completed under a Nitrogen blanket. Solder level sensing for accurate solder dipping. Integral component wash and dry facility. Preheating of components to negate thermal shock. The automated process is capable of handling most package styles but is not limited to them due to innovative handling fixtures. Typical component packages styles handled to date are: Semiconductors, Passives Electro mechanical components Integral part of process policing includes XRF measurement of the solder baths and were appropriate solderability checking. Solderability Checking in line with NPL best practice.

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