by Micross - 2013-05-20 15:15 - 12,502 views
One fo engineers testing electronic components
||Die and Wafer Storage
by Micross - 2013-05-20 15:14 - 12,196 views
This is a video of one of our storage facilities where we store
manufacturer's and customer owned parts.
by Micross - 2013-05-20 15:13 - 14,920 views
This is a wafer being sawn in our disco machine.
||Wafer View of Auto Pick and Place
by Micross - 2013-05-20 15:13 - 12,441 views
This the view of our equipment selecting die and picking it from a
wafer to be placed into packaging.
||Screen View of Auto Pick and Place
by Micross - 2013-05-20 15:13 - 12,561 views
This is the screen view of the equipment identifying and lining up
each indivisual die to be picked and placed in it's packaging.
||Auto Pick and Place Traying Die
by Micross - 2013-05-20 15:13 - 12,039 views
This is a view of our auto pick and place machine selecting die from
a silicon wafer and placing it trays dependent on grade.
||Automated Dipping and Solder Exchange
by Micross - 2013-05-20 15:12 - 15,609 views
Micross has designed and developed an automated solder dipping process capable of conforming to GEIA 006.
The process includes:-
Computer control of a six axis dipping robot.
Solder dipping completed under a Nitrogen blanket.
Solder level sensing for accurate solder dipping.
Integral component wash and dry facility.
Preheating of components to negate thermal shock.
The automated process is capable of handling most package styles
but is not limited to them due to innovative handling fixtures.
Typical component packages styles handled to date are:
Electro mechanical components
Integral part of process policing includes XRF measurement of the
solder baths and were appropriate solderability checking.
Solderability Checking in line with NPL best practice.
||Mini Circuits at NIWeek 2008
by MiniCircuits - 2013-05-20 15:10 - 17,032 views
Mini-Circuits NEW Power Sensor
• Operating frequency range of 1 MHz to 6 GHz
• 50 dB dynamic range, -30 dBm to +20 dBm
• Good VSWR, 1.1:1 (typical)
• Accuracy: ±0.15 dBm (typical)
• Linearity at 25 C is ±0.1 dBm (typical)
• Measurement speed is 200 ms
• No calibration after powering on (plug-in and measure)
• No external power supply is needed
• 16 simultaneous testing channels
• Temperature compensated
• Fully loaded power data analysis software
• Averaging of measurements
• Scheduled data recording
• Multi-Sensor support
• Interface with test software
by MiniCircuits - 2013-05-20 15:09 - 15,726 views