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Popular News
Daily News
Total : 11,049 ( 1105/1105 Pages)
Component Testing
by Micross - 2013-05-20 15:15 - 11,867 views
One fo engineers testing electronic components
Die and Wafer Storage
by Micross - 2013-05-20 15:14 - 11,592 views
This is a video of one of our storage facilities where we store manufacturer's and customer owned parts.
Wafer Sawing
by Micross - 2013-05-20 15:13 - 14,265 views
This is a wafer being sawn in our disco machine.
Wafer View of Auto Pick and Place
by Micross - 2013-05-20 15:13 - 11,786 views
This the view of our equipment selecting die and picking it from a wafer to be placed into packaging.
Screen View of Auto Pick and Place
by Micross - 2013-05-20 15:13 - 11,805 views
This is the screen view of the equipment identifying and lining up each indivisual die to be picked and placed in it's packaging.
Auto Pick and Place Traying Die
by Micross - 2013-05-20 15:13 - 11,540 views
This is a view of our auto pick and place machine selecting die from a silicon wafer and placing it trays dependent on grade.
Automated Dipping and Solder Exchange
by Micross - 2013-05-20 15:12 - 14,913 views
Micross has designed and developed an automated solder dipping process capable of conforming to GEIA 006. The process includes:- Computer control of a six axis dipping robot. Solder dipping completed under a Nitrogen blanket. Solder level sensing for accurate solder dipping. Integral component wash and dry facility. Preheating of components to negate thermal shock. The automated process is capable of handling most package styles but is not limited to them due to innovative handling fixtures. Typical component packages styles handled to date are: Semiconductors, Passives Electro mechanical components Integral part of process policing includes XRF measurement of the solder baths and were appropriate solderability checking. Solderability Checking in line with NPL best practice.
Mini Circuits at NIWeek 2008
by MiniCircuits - 2013-05-20 15:10 - 16,400 views
Mini-Circuits NEW Power Sensor • Operating frequency range of 1 MHz to 6 GHz • 50 dB dynamic range, -30 dBm to +20 dBm • Good VSWR, 1.1:1 (typical) • Accuracy: ±0.15 dBm (typical) • Linearity at 25 C is ±0.1 dBm (typical) • Measurement speed is 200 ms • No calibration after powering on (plug-in and measure) • No external power supply is needed • 16 simultaneous testing channels • Temperature compensated • Fully loaded power data analysis software • Averaging of measurements • Scheduled data recording • Multi-Sensor support • Interface with test software Only....$695.00
Vitel Booth
by MiniCircuits - 2013-05-20 15:09 - 15,065 views

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